DOW
DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND
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DOWSIL TC-5550 Thermal Conductive Compound is a high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare die architecture to provide long term reliability with excellent pump-out resistance performance.
Features & Benefits
Features & Benefits
- Good pump-out resistance for bare die application
- High thixotropy index(> 14)and solvent free formulation
- High thixotropy index(> 14)and solvent free formulation
- High thermal conductivity: 5.0W/mk
- Achieves thin Bond Line Thickness (BLT): 0.02mm at 40 psi
- Low thermal resistance: 0.04 °C-cm2/W at 40 psi
