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DOWSIL TC-5550 Thermal Conductive Compound

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DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND

DOWSIL TC-5550 Thermal Conductive Compound

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DOWSIL TC-5550 Thermal Conductive Compound is a high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare die architecture to provide long term reliability with excellent pump-out resistance performance. 

Features & Benefits
  • Good pump-out resistance for bare die application
  • High thixotropy index(> 14)and solvent free formulation 
  • High thixotropy index(> 14)and solvent free formulation 
  • High thermal conductivity: 5.0W/mk
  • Achieves thin Bond Line Thickness (BLT): 0.02mm at 40 psi
  • Low thermal resistance: 0.04 °C-cm2/W at 40 psi

Send enquiry for this product!

DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND




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Cookie Policy
The Ulbrich Group wants to offer you the best service possible. To achieve this, we save information about your visit in so-called cookies. By using this website, you consent to the use of cookies. You can click on the 'Additional information' button to find detailed information on the use of cookies on this website. You can also prevent cookies from being used by changing your browser settings.

Additional information

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