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DOWSIL TC-5550 Thermal Conductive Compound

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DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND

DOWSIL TC-5550 Thermal Conductive Compound

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DOWSIL TC-5550 Thermal Conductive Compound is a high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare die architecture to provide long term reliability with excellent pump-out resistance performance. 

Features & Benefits
  • Good pump-out resistance for bare die application
  • High thixotropy index(> 14)and solvent free formulation 
  • High thixotropy index(> 14)and solvent free formulation 
  • High thermal conductivity: 5.0W/mk
  • Achieves thin Bond Line Thickness (BLT): 0.02mm at 40 psi
  • Low thermal resistance: 0.04 °C-cm2/W at 40 psi

Send enquiry for this product!

DOWSIL TC-5550 THERMAL CONDUCTIVE COMPOUND




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