ELECTROLUBE TBS – Thermal Bonding System

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ELECTROLUBE TBS – THERMAL BONDING SYSTEM

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Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. It is especially useful in the manufacture of heat sink assemblies where ‘piggy back’ arrangements are applied and where the manufacture design of heat sinks does not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins. TBS is also ideal for use as a bonding medium in surface mounting assemblies.

Features

• Very good thermal conductivity. 
• Excellent electrical insulation characteristics. 
• Solvent free system ensures no 'honeycomb' effect on curing. 
• Unique filling system ensures that, after curing, mating surfaces cannot come into contact thus ensuring no electrical leakage through the bond. 
• Extremely thin curing coating of approx. 200 microns. 
• Ideal as bonding medium for surface mounting assemblies. 
• Components operate at thermal equilibrium thus ensuring uniform performance throughout the temperature range. 
• Bonds wide range of surfaces including dissimilar metals, epoxies, acrylics, poly-carbonates, etc. 
• Remains flexible until cured and any minor adjustments required can be effected. 
• Room temperature curing.

Pdf:

• ELECTROLUBE TBS Thermal Bonding System eng.pdf