Special ‘Sprayflux’ for PCBs wave soldering (WEEE/RoHS conformant) DIN EN 61190-1-1: (IEC RE/L0) or type 1.2.3.A according to ISO 9454
‘S-250/FRO’ is universally suitable for wave soldering PCBs. It complies with specification DIN-EN 29454/1.2.3.A or DIN 8511/F-SW 33. Accordingly, it contains organic, halogen-free activating additives and synthetic rosin in a combination specially tuned to the thermal require- ments of soldering processes.
‘S-250/FRO’ can be applied by brushing, spraying, dipping, etc., but not by foaming. It is advisable to dry the flux after application to transform the liquid into the activation phase, which favors the soldering operation. ‘S-250/FRO’ is sufficiently stable to retain its activity throughout the soldering process, so that the PCBs separate cleanly from the solder wave.
‘S-250/FRO’ is absolutely non-corrosive when tested to EN 61190-1-1. Furthermore, this test has shown no inadmissible change in the test board’s electrical surface resistance (SIR).
- Appearance: transparent liquid
- Solid content: 2.5%
- Density (20 °C):0,795 (+/- 0,003) g/ml
- Acid value: 21,0 - 25,0 mg KOH/g
- Activator: Carboxylic and dicarboxylic acids
- Solvent: Alcohol mixture
- Flash point:ca. 12 °C
