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PERMABOND 1K ES560

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Permabond

PERMABOND 1K ES560

PERMABOND 1K ES560

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PERMABOND ES560 is a single-part epoxy adhesive which flows when heated. It is unfilled and selflevelling, making it particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It has excellent thermal conductivity and shock resistance.

Features & Benefits
  • Excellent adhesive strength 
  • Excellent resistance to vibration 
  • Easy to use – no mixing required 
  • Low viscosity

Properties
Shear strength (Steel): 14-20 N/mm²
Hardness: 80 Shore D
Viscosity: 1,000-3,000 mPa.s
max. gap fill: 0.1 mm
Cure speed 120°C: 40 min
Appearance: Cured – translucent

Send enquiry for this product!

PERMABOND 1K ES560




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Cookie Policy
The Ulbrich Group wants to offer you the best service possible. To achieve this, we save information about your visit in so-called cookies. By using this website, you consent to the use of cookies. You can click on the 'Additional information' button to find detailed information on the use of cookies on this website. You can also prevent cookies from being used by changing your browser settings.

Additional information

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