PERMABOND 1K ES560

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Permabond

PERMABOND 1K ES560

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PERMABOND ES560 is a single-part epoxy adhesive which flows when heated. It is unfilled and selflevelling, making it particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It has excellent thermal conductivity and shock resistance.

Features & Benefits

• Excellent adhesive strength 
• Excellent resistance to vibration 
• Easy to use – no mixing required 
• Low viscosity

Properties
Shear strength (Steel): 14-20 N/mm²
Hardness: 80 Shore D
Viscosity: 1,000-3,000 mPa.s
max. gap fill: 0.1 mm
Cure speed 120°C: 40 min
Appearance: Cured – translucent

Pdf:

• TDS PERMABOND 1K ES560 eng.pdf