Bondexpo Internationale Fachmesse für Klebtechnologie
We invite you to visit us on our stand Nr. 7525-1 in Hall 7 at the Bondexpo fair in StuttgartEvery bonding and sealing application is unique. Factors such as the materials used, viscosity needed, gap filling, adhesion ,curing speed , production capacity and dispensing all need to be considered when selecting the ideal solution.Ulbrich Bond & Seal experts ensure, that every aspect relating to your specific application is analysed in detail.
Permabond application for smartphones and tablet computers
Permabond has prepared an application that will help you in choosing the right glue, adhesive joint design, advised on the preparation of surfaces prior to bonding, to help determine the use of adhesives to facilitate the conversion between the different units, ... In short, to facilitate the work.
Products to control the movement of the German manufacturer Weforma
We inform you that we have become an official representative of the products Weforma.In business Weforma the modern industrial shock absorbers, among other things, featuring a patented Helix, which allows up to four times higher energy absorption versus competitive built-in shock absorber equal rates, and other technologically ipopolnjeni products such as oil brake, rotary dampers, damper cylinders, air springs and metal pads.
