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Bondexpo Internationale Fachmesse für Klebtechnologie

Bondexpo Internationale Fachmesse für Klebtechnologie



We invite you to visit us on our stand Nr. 7525-1 in Hall 7 at the Bondexpo fair in Stuttgart

Every bonding and sealing application is unique. Factors such as the materials used, viscosity needed, gap filling, adhesion ,curing speed , production capacity and dispensing all need to be considered when selecting the ideal solution.

Ulbrich Bond & Seal experts ensure, that every aspect relating to your specific application is analysed in detail.


Bondexpo Internationale Fachmesse für Klebtechnologie
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