With the ever-progressing development and downsizing it is crucial to effectively dissipate heat from electronic components which are generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes. Our extensive Thermal Interface Material (TIM) Range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.
We can provide you:
- Silicone based & Non-Silicone Thermal Pastes
- Thermal Gap Fillers
- Phase Change Materials
- Silicone & Non-Silicone Gap Pads
- RTVs and Bonding Products
- Encapsulation Resins
- Thermal insulators
- Thermal graphite sheets
- Thermal tapes
- Up to 5.5W/m.K thermal conductivity