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DOWSIL™ CN-8760 Thermally Conductive Encapsulant

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DOWSIL™ CN-8760 THERMALLY CONDUCTIVE ENCAPSULANT

DOWSIL™ CN-8760 Thermally Conductive Encapsulant

Send enquiry for this product!
DOWSIL™ CN-8760 Thermally Conductive Encapsulant  
Two-part, 1 to 1, room temperature and heat curable to give manufacturing flexibility, gray elastomer with moderate thermal conductivity.  


Applications
DOWSIL™ CN-8760 Thermally Conductive Encapsulant is suitable for:
  • Power modules 
  • Adaptors 
  • Inverters 
  • Transformers 
  • Ballasts 
  • Sensors 
  • Electric control units product




Features & Benefits
  • Low viscosity 
  • Good thermal conductivity 
  • 1 to 1 mixing ratio 
  • Room temperature curing 
  • UL 94 V0 certified 
  • Easy to mix and use 
  • Good flowability for fast processing and short cycle times 
  • Aids heat dissipation

Send enquiry for this product!

DOWSIL™ CN-8760 THERMALLY CONDUCTIVE ENCAPSULANT




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