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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit

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DOWSIL™ EE-1010 LOW VISCOSITY ENCAPSULANT KIT

DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit

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DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit  
Suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step.  


Features & Benefits
  • Long working time 
  • Room temperature cure or accelerated heat cure 
  • High hardness/durometer compared to other PCB system assemblies encapsulants 
  • Moderate thermal conductivity 
  • Different colors for Part A and Part B for easy identification of mixing 
  • In complex geometries, low viscosity enhances flow and fill in narrow spaces and long working time enables air displacement 
  • Rapid, versatile cure processing controlled by temperature 


Composition
  • Two-part 
  • 1 to 1 mix ratio 
  • Polydimethylsiloxane silicone elastomer 


Applications
  • DOWSIL™ EE-1010 Low Viscosity Encapsulant is suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step 
  • Material can be dispensed manually or through meter mixing 

Send enquiry for this product!

DOWSIL™ EE-1010 LOW VISCOSITY ENCAPSULANT KIT




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Cookie Policy
The Ulbrich Group wants to offer you the best service possible. To achieve this, we save information about your visit in so-called cookies. By using this website, you consent to the use of cookies. You can click on the 'Additional information' button to find detailed information on the use of cookies on this website. You can also prevent cookies from being used by changing your browser settings.

Additional information

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