DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Two-part, 1 to 1 mix ratio, low viscosity encapsulant
Has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices.
Lower System Cost Using More Reliable Encapsulants that Protect Longer Against Tough Climatic ConditionsDOWSIL™ EE-3200 Low Stress Silicone Encapsulant combines the stress relieving properties of a gel with the thermal conductivity of an encapsulant.
This material is successfully proven in solar inverters, where it provides best-in-class protection of sensitive components against repeated thermal and mechanical stress, as well as moisture and other punishing environmental factors. Using silicone encapsulants help solar manufacturers to achieve higher system value and lower system costs.
Features & Benefits
- Soft, low durometer
- Low viscosity
- Room temperature or accelerated heat cure
- Good thermal conductivity
- Mix ratio 1 to 1
- Low internal stress during thermal cycling
- Highly flowable for filling small gaps and fast processing
- Good heat dissipation
- Prevents water ingress
- Electrically insulative
- Low total cost of ownership
- Approved for railways standard EN45545-2: R22/R23/R24/R25/R26 – HL3
Composition
- Two-part
- Polydimethylsiloxane
Applications
DOWSIL™ EE-3200 Low Stress Encapsulant has a very low hardness and viscosity to
minimize internal stress generation, fill small gaps, and improve manufacturing speed for
complex and high volume devices. Excellent flame resistance and protection against water
ingress that improve the safety and reliability under harsh outdoor environments such as:
- Power Conversion Devices (Inverters, Converters)
- Junction Boxes
- Automotive PCB Modules
- Railways PCB Systems Applications
