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DOWSIL™ EG-3896 Kit

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DOWSIL™ EG-3896 KIT

DOWSIL™ EG-3896 Kit

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DOWSIL™ EG-3896 Kit  
Suitable for potting and protecting of electronics devices, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.  


Features & Benefits
  • Slightly hazy to clear 
  • Fast heat cure gel 
  • UL 94 V-1 flammability classification 
  • Suitable for operating temperatures ranging from -40°C to +185°C 
  • Improved resistance to crack formation 
  • Excellent flowability 


Composition
  • Two-part polydimethylsiloxane gel



Applications
DOWSIL™ EG-3896 Dielectric Gel is suitable for potting and protecting of PCB system assemblies, especially power semiconductor modules to protect dies and interconnects from environmental conditions and to provide dielectric insulation.

Send enquiry for this product!

DOWSIL™ EG-3896 KIT




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Cookie Policy
The Ulbrich Group wants to offer you the best service possible. To achieve this, we save information about your visit in so-called cookies. By using this website, you consent to the use of cookies. You can click on the 'Additional information' button to find detailed information on the use of cookies on this website. You can also prevent cookies from being used by changing your browser settings.

Additional information

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