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DOWSIL™ X3-6211 Encapsulant

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DOWSIL™ X3-6211 ENCAPSULANT

DOWSIL™ X3-6211 Encapsulant

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DOWSIL™ X3-6211 Encapsulant  
One-part, clear, UV cure.  


Features & Benefits
  • One-part 
  • UV cure gel with no mixing required 
  • Suitable for very low temperatures 


Composition

  • No mixing required 
  • UV curable for extremely fast processing speeds 
  • Gel remains flexible in very low temperature applications



Applications
DOWSIL™ X3-6211 Encapsulant is designed for very fast UV cure over relatively flat and less complicated circuit boards.

Send enquiry for this product!

DOWSIL™ X3-6211 ENCAPSULANT




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Cookie Policy
The Ulbrich Group wants to offer you the best service possible. To achieve this, we save information about your visit in so-called cookies. By using this website, you consent to the use of cookies. You can click on the 'Additional information' button to find detailed information on the use of cookies on this website. You can also prevent cookies from being used by changing your browser settings.

Additional information

Continue