DOWSIL™ X3-6211 Encapsulant

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DOWSIL™ X3-6211 ENCAPSULANT

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DOWSIL™ X3-6211 Encapsulant  
One-part, clear, UV cure.  


Features & Benefits

• One-part 
• UV cure gel with no mixing required 
• Suitable for very low temperatures 

Composition

• No mixing required 
• UV curable for extremely fast processing speeds 
• Gel remains flexible in very low temperature applications

Applications
DOWSIL™ X3-6211 Encapsulant is designed for very fast UV cure over relatively flat and less complicated circuit boards.

Pdf:

• TDS DOWSIL X3 6211 Encapsulant.pdf