Elecolit® 3043 is a high-performance, silver-filled, 1-part epoxy adhesive engineered for demanding microelectronic applications. Featuring a low-viscosity, flowable formula, it provides exceptional electrical and thermal conductivity while ensuring easy automated dispensing for precise component contacting.
Key Features:
- Single-Part Heat Cure: Ready-to-use 1-part formulation that cures rapidly under heat without requiring mixing.
- Dual Conductivity: Delivers high electrical conductivity alongside strong thermal performance.
- Low Viscosity: Flowable consistency optimized for precise micro-dispensing and contacting electronic components.
- High Reliability: Solvent-free structure with low ion content, built for robust temperature resistance in advanced electronic assemblies.
Typical
Applications: Antenna
Printing,
Ceramic Fuses
- Base: 1-part Epoxy
- Viscosity (mPas): 4,000 - 5,000
- Curing: 10 min at 150 °C
- Temperature Resistance (ºC): -40 to +180
- Contact Resistance
ohms x cm: 0,015
