Elecolit® 325 is a high-performance, pure silver-filled, 2-part epoxy adhesive designed for cold-curing and heat-sensitive electronics applications. Combining structural epoxy strength with exceptional electrical and thermal conductivity, it serves as an efficient, reliable alternative to traditional metal soldering.
Key Features:
- Dual Conductivity: Delivers outstanding electrical and thermal performance for effective heat dissipation and circuit connectivity.
- Versatile Curing: Capable of standard room-temperature curing, with significantly accelerated curing times achieved under moderate heat.
- User-Friendly Mix: Features an easy-to-use 1:1 mixing ratio by weight or volume with a convenient 1 to 2-hour pot life.
- Flexible Processing: Smooth paste consistency optimized for automated dispensing, stamping, or screen-printing applications.
