Elecolit® 327 is an advanced, silver-filled, 1-part polyimide adhesive engineered for high-reliability microelectronics operating under extreme thermal conditions. Combining exceptional electrical and thermal conductivity with an impressive operating range up to 275 °C, it provides outstanding performance for specialized semiconductor and die-attach applications.
Key Features:
- Extreme Temperature Resistance: Built to withstand continuous operating temperatures up to 275 °C with high thermal stability.
- Superior Substrate Adhesion: Delivers outstanding bond strength to gold, aluminum, tantalum, germanium, and ceramics. Ultra-Low Ion Purity: Formulated with minimal ion content (≤
5 ppm for key ions like chlorides and sodium), preventing corrosion in sensitive electronic components.
- Ready to Use 1-Part Formula: Paste-like, solvent-free consistency optimized for precision dispensing and thermal-cure manufacturing workflows.
