Elecolit® 336 is a silver-filled, solvent-free, 2-part epoxy resin adhesive engineered for robust cold-curing and heat-sensitive electronics applications. Featuring a convenient 1:1 mix ratio and an accommodating 2-hour pot life, it delivers exceptional gap-filling capabilities alongside reliable electrical and thermal performance.
Key Features:
- Dual Conductivity: Provides dependable electrical connectivity and high thermal conductivity for effective heat dissipation.
- Versatile Curing: Capable of curing at room temperature, with significantly accelerated cure times achievable under moderate heat.
- Flexible Processing: Paste-like consistency optimized for automated dispensing, stamping, or screen-printing methods.
- Superior Gap Filling: Excellent structural and conductive performance for cold-curing applications and heat-sensitive component assembly.
