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ENCAPSULATION RESINS

EN AT DE CZ SI SK HR 


ENCAPSULATION RESINS

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Encapsulation Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than that offered by conformal coatings. 

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products.

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ENCAPSULATION RESINS




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Cookie Policy
The Ulbrich Group wants to offer you the best service possible. To achieve this, we save information about your visit in so-called cookies. By using this website, you consent to the use of cookies. You can click on the 'Additional information' button to find detailed information on the use of cookies on this website. You can also prevent cookies from being used by changing your browser settings.

Additional information

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