PANACOL Elecolit 323

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Panacol

PANACOL ELECOLIT 323

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Elecolit® 323 is a silver-filled 2 part epoxy adhesive specially developed for the bonding of open chip components. Elecolit® 323 is semiconducting (Na +, K +, Cl- <10ppm) and passed the autoclave test
(1000h).

It is designed for potting, bonding or contacting of conductors.

Pdf:

• TDS PANACOL Elecolit 323 eng.pdf