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Elecolit® 3655 is a one-component, silver filled, solvent-free, low-viscosity conductive adhesive. Due to
the small grain size (<10μm) of the silver particles it can be dosed well, even with small needle diameters without clogging. It is distinguished by its very high filling density, good thermal
conductivity and low ion content (Na +; K +; Cl- <10 ppm).
It has been developed especially for the
requirements in semiconductor technology as well as for LED-attach production.
After prolonged storage, the product must be homogenized because the silver naturally sediments in the
low-viscosity resin.