PANACOL Structalit 5604

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Panacol

PANACOL STRUCTALIT 5604

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Structalit® 5604 is a thermal curing, one component SMD adhesive, showing fast curing properties at low temperatures. The SMD adhesive shows a solid shock behavior. The material can be applied by
using common industrial techniques: dispensers, screenprint, needle transfer. It is recommended to cure not more than 0,4g adhesive at once.

The product can be used as SMD adhesive for soldering temperatures in short processes (max. 5 minutes) at temperatures up to 270° C.

Pdf:

• TDS PANACOL Structalit 5604 eng.pdf