PANACOL Structalit 5605

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Panacol

PANACOL STRUCTALIT 5605

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Structalit® 5605 is a thermal curable one-component SMD adhesive with extremely fast curing at low temperatures. The adhesive is characterized by good shock resistance. The application is easily possible with dispenser, screen printing or via needle transfer.

Structalit® 5605 can be used as a SMD adhesive for soldering temperatures (max. 5 min.) up to 270 ° C. No more than 2 g of adhesive may be cured at a time.

Pdf:

• TDS PANACOL Structalit 5605 eng.pdf