Structalit® 5604 is a high-performance, single-component, solvent-free modified epoxy adhesive designed specifically for electronics manufacturing and surface-mount technology (SMD). Engineered for rapid thermal curing, it provides exceptional bond strength and reliable thermal resistance.
Key Features and Benefits:- Fast Thermal Curing: Cures quickly at moderate temperatures (e.g., in just a few minutes at 150°C).
- High Heat Resistance: Withstands temporary exposure to high soldering temperatures up to 270°C for up to 5 minutes.
- Thixotropic High Viscosity: Features a smooth, red, paste-like consistency (25,000 – 40,000 mPa·s) that prevents running or sagging during application.
- Excellent Mechanical Stability: Offers high shock resistance and robust structural integrity post-cure.
Typical Applications:- SMD & PCB Assembly: Pinning and fixing surface-mount electronic components onto printed circuit boards prior to wave or reflow soldering.
- General Electronics Bonding: Securing microelectronic parts, die-attach applications, and smart card construction where resistance to thermal stress is required.
