Structalit® 5893 is a high-performance, single-component, solvent-free modified epoxy adhesive engineered for demanding electronics, industrial, and medical-grade applications. It offers reliable bonding strength and exceptional thermal stability, making it ideal for precision manufacturing.
Key Features and Benefits:- Efficient Heat Curing: Cures rapidly under thermal application (e.g., at 150°C) to streamline production throughput.
- Low Viscosity Profile: Features a smooth, manageable liquid consistency (6,000 – 10,000 mPa·s) that allows for precise dispensing and penetration into tight spaces.
- Medical Grade Certification: Certified according to ISO 10993-5 standards, making it well-suited for sensitive healthcare and device manufacturing.
- High Thermal Resistance: Withstands operational temperatures up to 200°C while maintaining strong structural integrity.
Typical Applications:- Medical Devices: Assembling specialized medical housings, disposables, and diagnostic components.
- Glob Top & Microelectronics: Encapsulating and protecting sensitive microchips and semiconductor components.
- Challenging Substrate Bonding: Securely joining difficult-to-bond materials, including various technical plastics and metals like steel, polypropylene, and polyethylene.
